New Step by Step Map For Noohapou
Remote spots: Static models are typically situated remotely, growing Value and lowering Over-all technique performance.
Instrument & TCU computer software calibration processes range external examination devices not used frequently for verifying
the data under is categorized by semiconductor system and Software maker. Every single desk involves an Applications Matrix that shows qulified and commercial procedures.
at first Established in 1985, our organization has grown into a acknowledged leader in offering temperature control techniques to the global semiconductor marketplace.
LAUDA-Noah will, for your consumer's retrofit analysis, watch and change its fluid temperature control profiles to match an present TCUs' in order to ensure a clean course of action integration by using DAQ.
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All static TCUs need excessive cooling & heating capacities due to their really large system fluid reservoirs. The process fuid reservoir on LAUDA-Noah's dynamic temperature control process is under one gallon.
While using the POU3300, it is possible to realize unparalleled ends in etch performance, chamber uptime, reduced cost of ownership and fab space utilization – all although bettering your process dependability.
the info pertains to some 300mm chamber temperature profile all through a substantial component ratio Etch approach, working at pretty significant RF electricity situations (~three.8kW). The persuasive components of this information set are:
Dynamic Temperature Regulate, as implemented in devices much like the LAUDA-Noah POU, is definitely an approach that senses the temperature of the method fluid getting back from the method chamber’s wafer chuck (ESC) and dynamically adjusts the temperature in the equipped system fluid depending on this true-time feedback.
the information set Here's from a 200mm quantity manufacturing wafer fab and clearly illustrates the good thing about the LAUDA-Noah POU method.
The POU3300 technique presents dynamic temperature Charge of the procedure chamber cathode / electrode / anode and can be synchronized with any etch approach.
The reality is usually that genuine Dynamic Temperature Management can only be obtained when all 5 (five) of the next procedure layout and installation prerequisites are achieved:
(for that reason, installing a static unit close to chamber will never permit it to deliver dynamic temperature control)
We involve significantly less cooling/heating capacity for a similar application as a static TCU on account of our small reservoir quantity.